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The Industry's Best, NEW Technology Has Finally Arrived!
 Click here to read our technical bulletin as a PDF file
 As part of Wisdom Adhesives overall strategic plan to continue on it’s path as the leading customer focused adhesive supplier in the industry, Wisdom Adhesives announces the introduction of a new & improved ClearBond™ Hot Melt adhesive technology for the Packaging Industry. Key features of the product line are listed below:
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Economical - from an extended mileage, performance and density standpoint. Compares
favorably vs. competitive EVA and other olefin based adhesive products. Up to 35% savings! |
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ClearBond adhesives offer excellent adhesion properties. |
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ClearBond adhesives offer excellent thermal & pot-stability – best in adhesive industry. |
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Clear / White in color. |
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ClearBond adhesives offer increased mileage due to lower density and higher performance – often resulting in a minimum of a 35% reduction to the overall cost vs. standard competitive products. |
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Eliminate downtime and maintenance costs. |
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Eliminate gels and charring. |
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Low to no odor. |
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Extended runability – excellent pot stability. |
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New technology is easy to run and easy to use. Just another reason to convert to Wisdom Adhesives. |
Typical Specifications for ClearBond Adhesives
Property |
H5002*
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H5001*
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H5008*
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H5004LT
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Type |
General Purpose
High Heat Resistance |
Specialty Adhesive for Enhanced Adhesion |
High Heat Resistant Product |
General Purpose
Freezer Grade |
Suggested Application Temperature |
325F-350F |
350F |
350F |
250F – 275F |
Viscosity |
800 cps at 350F |
1100 cps at 350F |
1100 cps at 350F |
800 cps at 275F |
Color |
White/Clear |
White/Clear |
White/Clear |
White/Clear |
Speed of Set |
Fast |
Fast |
Fast |
Medium-Fast |
Heat Resistance |
Excellent |
Excellent |
Excellent |
Moderate |
Freezer Resistance |
Moderate |
Good |
Good |
Excellent |
Density (Specific Gravity) |
0.91 |
0.91 |
0.91 |
0.91 |
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* High Temperature / Higher Heat Resistant Product
** Low Temperature Application Product
Note: Specifications are determined using standard laboratory tests based on ASTM or other similar protocol and are subject to the actual product technical data sheet. |
Product |
Technology |
% Solids |
Performance Characteristics |
Cost Applied |
Estimated Cost Savings |
H5002 (General Purpose) |
ClearBond |
100% |
Excellent adhesion, Extended Mileage, Very fast set-up, Excellent runability, very low maintenance cost, low odor. Excellent Pot Stability |
Up to 35% lower vs. Market Rate Based on Mileage |
Up to 25% vs. Market Rate |
H5001
(Enhanced Adhesion) |
ClearBond |
100% |
Excellent adhesion, Extended Mileage, Very fast set-up, Excellent runability, very low maintenance cost, low odor. Excellent Pot Stability |
Up to 35% lower vs. Market Rate Based on Mileage |
Up to 25% vs. Market Rate |
H50028 (Enhanced Heat Resistance) |
ClearBond |
100% |
Excellent adhesion, Extended Mileage, Very fast set-up, Excellent runability, very low maintenance cost, low odor. Excellent Pot Stability |
Up to 35% lower vs. Market Rate Based on Mileage |
Up to 25% vs. Market Rate |
H5004LT
(Low Temperature Applyable) |
ClearBond |
100% |
Excellent adhesion, Extended Mileage, Very fast set-up, Excellent runability, very low maintenance cost, low odor. Excellent Pot Stability |
Up to 35% lower vs. Market Rate Based on Mileage |
Up to 25% vs. Market Rate |
Competitive Hot Melt Adhesive |
Conventional Hot Melt Technology |
100% |
Good-Excellent adhesion, fast set-up, Moderate-Good runability and clean-up. |
Market Rate |
Market Rate |
| Note: The above results are based on actual field information. Results may vary depending on type of finished product being made and process conditions. Cost comparison may vary depending on actual pricing. |
THERMAL STABILITY
Improved Mileage: ClearBond Technology can be expected to save 25-50% advantage in mileage based on superior aggressive adhesion technology (lowering bead size) and lower density not factored above in savings example (0.93 vs. 0.97); both resulting in the use of less adhesive usage vs. EVA based technology.
Better Thermal Pot Stability: Please see the images below; indicating the color change of ClearBond type technology vs. EVA based technology when held for hours/days at application temperatures. This better pot stability will result in longer pot-life for less waste, wider service temperature range, reduced downtime and maintenance costs and adherence to a wider range of surfaces. No downtime!
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