 |
 Click here to read as a PDF file
The following procedure is suggested from changing from a conventional hot melt adhesives to Wisdom Adhesives PolyTak & ClearBond Products.
- Completely drain the current conventional hot melt adhesive for the adhesive melt pot. This includes all dispensing lines.
- Removal all filters and screens.
- Using a plant approved solvent – such as high boiling citrus based cleaning solvents – and cleaning chisels & scrappers, thoroughly clean the inside of the glue pot (via wiping with dampened rags), the outside of the glue pot and melt unit, all screens and filter as well as the dispensing head. Be sure that all of the cleaned components are completely dry (no citrus residue) before putting back into the melt unit.
- Fill the adhesive pot with PolyTak or ClearBond adhesive, and set the melt temperature to 300F. At 300°F the PolyTak or ClearBond product will be higher in viscosity and better able to purge the system of previously charred material.
- An alternative method is to use the HC0001 Hot Melt Liquid Cleaner to Purge the pots. Fill the melt tank with 2/3 to 3/4 of the HC0001 and heat to 250F for approximately 2-4 hours to allow thorough cleaning. Purge the pot and lines with the HC0001 in a similar fashion as instructed below with the PolyTak or ClearBond product. Repeat if necessary
- Allow the PolyTak ClearBond adhesive to completely melt.
- Purge and drain the PolyTak ClearBond material completely and perform additional cleaning on screen, filters, inside of pot and pot exterior.
- At this point, there may still be visible char remaining that can optionally be removed or deemed fit for use. As in any cleaning, there will be previously charred material that may cause plugging of nozzles in the coming days and weeks. This is normal, and should be considered part of the cleaning procedure. Once all of the char is completely purged, there will be little need to do it again, once PolyTak or ClearBond is only being used.
- Refill the pot with PolyTak or ClearBond adhesive, set melt temperature to 350°F.
- Allow the PolyTak or ClearBond to completely melt.
- Once the adhesive is melted, perform minor purging of the nozzle and the adhesive product and hot melt dispensing system is ready to go. It should be noted that often times, a drastically reduced pressure (approximately 50% of typical) can be used to dispense the PolyTak or ClearBond product.
Note: There will be a need to monitor the adhesive usage and checking for loosening of any charred or gelled material that was not able to be purged during the above changeover procedure. A modified and shortened version of the above procedure may need to be used again to thoroughly purge the system and set it ready for POLYTAK or CLEARBOND use.
|
|
