ClearBond

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As part of Wisdom Adhesives’ overall strategic plan to continue on its path as the leading customer focused adhesive supplier in the industry, Wisdom Adhesives announces the introduction of a new & improved ClearBond™ Hot Melt adhesive technology for the Packaging Industry. Key features of the product line are listed below:

  • Economical – from an extended mileage, performance and density standpoint. Compares favorably vs. competitive EVA and other olefin based adhesive products. Up to 35% savings!
  • ClearBond adhesives offer excellent adhesion properties.
  • ClearBond adhesives offer excellent thermal & pot-stability – best in adhesive industry.
  • Clear / White in color.
  • ClearBond adhesives offer increased mileage due to lower density and higher performance – often resulting in a minimum of a 35% reduction to the overall cost vs. standard competitive products.
  • Eliminate downtime and maintenance costs.
  • Eliminate gels and charring.
  • Low to no odor.
  • Extended runability – excellent pot stability.
  • New technology is easy to run and easy to use. Just another reason to convert to Wisdom Adhesives.
Property H5002* H5001* H5008* H5004LT
Type General Purpose High Heat Resistance Specialty Adhesive for Enhanced Adhesion High Heat Resistant Product General Purpose Freezer Grade
Suggested Application Temperature 325F-350F 350F 350F 250F – 275F
Viscosity 800 cps at 350F 1100 cps at 350F 1100 cps at 350F 800 cps at 275F
Color White/Clear White/Clear White/Clear White/Clear
Speed of Set Fast Fast Fast Medium-Fast
Heat Resistance Excellent Excellent Excellent Moderate
Freezer Resistance Moderate Good Good Excellent
Density (Specific Gravity) 0.91 0.91 0.91 0.91
* High Temperature / Higher Heat Resistant Product
** Low Temperature Application Product

Note:  Specifications are determined using standard laboratory tests based on ASTM or other similar protocol and are subject to the actual product technical data sheet.
Product Technology % Solids Performance Characteristics Cost Applied Estimated Cost Savings
H5002 (General Purpose) ClearBond 100% Excellent adhesion, Extended Mileage, Very fast set-up, Excellent runability, very low maintenance cost, low odor. Excellent Pot Stability Up to 35% lower vs. Market Rate Based on Mileage Up to 25% vs. Market Rate
H5001(Enhanced Adhesion) ClearBond 100% Excellent adhesion, Extended Mileage, Very fast set-up, Excellent runability, very low maintenance cost, low odor. Excellent Pot Stability Up to 35% lower vs. Market Rate Based on Mileage Up to 25% vs. Market Rate
H50028 (Enhanced Heat Resistance) ClearBond 100% Excellent adhesion, Extended Mileage, Very fast set-up, Excellent runability, very low maintenance cost, low odor. Excellent Pot Stability Up to 35% lower vs. Market Rate Based on Mileage Up to 25% vs. Market Rate
H5004LT (Low Temperature Applyable) ClearBond 100% Excellent adhesion, Extended Mileage, Very fast set-up, Excellent runability, very low maintenance cost, low odor. Excellent Pot Stability Up to 35% lower vs. Market Rate Based on Mileage Up to 25% vs. Market Rate
Competitive Hot Melt Adhesive Conventional Hot Melt Technology 100% Good-Excellent adhesion, fast set-up, Moderate-Good runability and clean-up. Market Rate Market Rate
Note: The above results are based on actual field information. Results may vary depending on type of finished product being made and process conditions. Cost comparison may vary depending on actual pricing.

THERMAL STABILITY

Improved Mileage: ClearBond Technology can be expected to save 25-50% advantage in mileage based on superior aggressive adhesion technology (lowering bead size) and lower density not factored above in savings example (0.93 vs. 0.97); both resulting in the use of less adhesive usage vs. EVA based technology.

Better Thermal Pot Stability: Better pot stability will result in longer pot-life for less waste, wider service temperature range, reduced downtime and maintenance costs and adherence to a wider range of surfaces.  No downtime!